UP-3X Android Smart Retail Industry Boards

Qauv No.

U P-3 X

Pawg

Android Niam Board

Chipset

Rockchip

CPU/Processor

RK 3288 Plaub Lub Core Cortex_A17@1.8GHz

GPU

Mali-T764

OS

Pom zoo: Android 7.1
Yeem xaiv tau: Android 5.1/6.0

Kev daws teeb meem

4Kx2K@60fps decoding, H.264, H.265, puv HD

RAM

Txheem 2GB_DDR3, 4GB xaiv tau

ROM

Tus qauv 16GB_EMMC, Max. 128GB xaiv tau

Kev Txuas Ntxiv Chaw Khaws Khoom

1 * Micro SD qhov xaiv tau: Max. 128GB txhawb nqa

Cov Chaw Nres USB

4* USB 2.0,
8 * USB pin headers
1 * OTG tus pin header

Chaw nres nkoj Serial

1* RS-232 DB-9
2 * TTL/RS-232 tus pin headers
1 * TTL debug serial chaw nres nkoj

Zaub Interface

2 * LVDS, 2 * EDP, Txhawb Dual Screen Zaub

Chaw nres nkoj them nyiaj ntsuab

1 * RJ11 6-pin tus qauv nyiaj ntsuab lub thawv txuas + 4-Pin header

Ethernet

10/100M Adaptive Ethernet RJ45 connector + 4-Pin header

Lwm qhov chaw nres nkoj I/O

HDMI nkag, HP/MIC, Amp., GPIO Cov Cim, Kab nkag/tawm, DC-12V, Nano-SIM daim npav qhov thiab lwm yam

WiFi

Ua-nyob rau hauv WiFi module, txhawb IEEE 802.11 b/g/n

Mini PCI-E 4G

Txheem MiniPCI-E 4G module interface nrog Nano-SIM daim npav qhov (socket)

Bluetooth

BT V2.1+ EDR/BT v3.0/BT v3.0+ HS/BT v4.0

Lub Koob Yees Duab

Txhawb nqa lub koob yees duab USB hauv 2 lab pixels

Qhov Loj

170mm * 105mm (Ntev * Dav)

Ib puag ncig ua haujlwm

Kub: 0°C ~ 70°C
Av noo: 0% ~ 95% (tsis-condensing)