Hongzhou Smart - E etella pele ka lilemo tse 15 le ho feta OEM le ODM
moetsi oa tharollo ea kiosk turnkey
Tšebeletso ea PCBA ea Kopano ea Hotsale Custom PCB
| Sehlooho | Tlhaloso | Bokhoni |
| Thepa | Lisebelisoa tse entsoeng ka laminate | FR4, Alu, CEM3, Taconic, Rogers |
| Ho seha boto | Palo ea mekhahlelo | 1-58 |
| Botenya ba bonyane bakeng sa lera le ka hare | 0.003”(0.07mm) | |
| (Botenya ba Cu ha bo a kenyelletswa) | ||
| Botenya ba boto | E tloaelehileng | 0.04-0.16”±10%(0.1-4mm±10%) |
| Bonyane. | Lera le le leng/le habeli: 0.008±0.004” | |
| Lera tse 4: 0.01±0.008” | ||
| Lera la 8: 0.01±0.008” | ||
| Sekama le ho sotha | <7/1000 | |
| Boima ba koporo | Boima ba Kantle ba Cu | 0.5-4 oz |
| Boima ba Cu ea ka hare | 0.5-3 oz | |
| Ho cheka | Boholo bo fokolang | 0.0078” (0.2mm) |
| Ho kheloha ha ho tjheseletsa | ± 0.002” (0.05mm) | |
| Mamello ea lesoba la PTH | ± 0.002” (0.005mm) | |
| Mamello ea masoba a NPTH | ± 0.002” (0.005mm) | |
| Ho betla | Boholo bo fokolang ba lesoba | 0.0008” (0.02mm) |
| Karolelano ea ponahalo | 20 (5:1) | |
| Maske ea solder | 'Mala | Botala, bosweu, botsho, bofubedu, bosehla, boputsoa... |
| Sebaka se senyenyane sa ho tlosa maske se nang le solder | 0.003” (0.07mm) | |
| Botenya | 0.0005-0.0007”(0.012-0.017mm) | |
| Sekirini sa silika | 'Mala | Bosweu, botsho, bosehla, bofubedu, boputsoa... |
| Boholo bo fokolang | 0.006” (0.15mm) | |
| Teko ea elektronike | Setei sa ho Lekola ho Fofa | Y |
| Impedance e laoloang | Mamello | ±10% |
| Teko ea Impedance | Tektronix TDS8200 | |
| Qetello ea Bokaholimo | HASL, ENIG, silevera ea ho qoelisoa, thini ea ho qoelisoa, OSP ... | |
| Tšebeletso ea Tlhahiso ea Elektroniki ea EMS |
| Phepelo le Sebopeho sa PCB |
| Kopano ea PCB ho SMT, BGA le DIP |
| Ho Fumana Likarolo Tse Atlehang ka Litšenyehelo |
| Pontšo ea Potlako le Tlhahiso ea Boima |
| Kopano ea Kaho ea Mabokose |
| Tšehetso ea Boenjiniere |
Liteko (X-ray, Botenya ba 3D Paste, ICT, AOI le liteko tsa Ts'ebetso) |
| Tšebeletso ea Thepa le ea Kamora ho rekisa |
| Molemo oa rona: |
| 1. Khamphani ea rona ka TS16949: Setifikeiti sa sistimi ea boleng ba 2009, ho romelloa ha lihlahisoa tse sebetsitsoeng ho latela maemo a Europe |
| 2. Ha ho na lithibelo tse fokolang tsa bongata ba odara, tšehetso e felletseng ho tloha ho netefatseng ho isa ho sehlopha. |
| 3. Sehlopha sa litsebi sa ho fumana likarolo, ho reka ka hare, o boloka litšenyehelo tsa theko, litšenyehelo tsa basebetsi, litšenyehelo tsa boleng. |
| 4. Ho netefatsa ka potlako: Disampole tsa SMT dihora tse 24 tsa ho pepa. |
| 5. Lihlopha tsa rona tse ka sehloohong tsa bareki: tsa bongaka, tsa indasteri, tsa tshireletso, tsa puisano, tsa motlakase le tse ling tsa maemo a holimo |
6. Theknoloji ea Shenzhen Jingbang ka har'a "bareki ba batla ho hongata hanyane hore bareki ba rona ba etse ho hongata ho theha motheo bakeng sa merero ea litšebeletso tsa boleng bo holimo le tse shebaneng le litšebeletso". |
| FAQ | |
| P: U ka fumana khotheishene joang? | |
K: Ka kopo re romelle lintlha tse ling tsa RFQ (tse kang Faele ea GERBER, BOM (bili ea Thepa), sampole/litšoantšo, Ponelopele kapa Palo ea Litšupiso jj.) | |
| P: MOQ ea hau bakeng sa PCBA ke efe? | |
K: Ha ho na MOQ bakeng sa PCBA. Re ka etsa prototype le tlhahiso ea bongata hape. Ho na le E theko e tlase Bongata ba Odara (EOQ), Ka kopo re romelle potso bakeng sa lintlha tse qaqileng. | |
| P: Na o ka etsa ditshebeletso tsa turnkey? Na o ka re rekela dikarolo tsohle ka BOM? | |
| K: Ka lebaka la MOQ & MPQ ea Likarolo, ho latela bongata ba odara: | |
| *Re ka rata ho sebetsana le theko ea BOM bakeng sa MP (Matss Production) | |
*Re rata hore Moreki a fane ka likarolo bakeng sa Prototype le odara ea Pilot. Ka kopo romela lipotso. ho rona bakeng sa lintlha tse ling. | |
| P: L/T ea hau bakeng sa PCBAs ke bokae? | |
K: Nako ea ho etella pele ea PCBA hangata ke libeke tse 2. Kaho ea kamora teko le lebokose li ka nka nako e telele ho feta ea ho etella pele. Litaelo tse Nepahetseng tsa libeke tse 3, SOP le Fixture ea Teko e Ntle li ka potlakisa L/T. | |
| P: Na mapolanka a tla lekoa pele a romelloa? | |
| A: Bakeng sa PCBA, re tla ba le AOI, X-ray, le teko ea ts'ebetso. |
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