I-Hongzhou Smart - Ihola i-OEM ne-ODM iminyaka engaphezu kwengu-15
umenzi wesisombululo se-kiosk turnkey
Isevisi ye-PCB PCBA Isevisi Yokukhiqiza Izinto Ezisebenza Ngogesi Ezine-Stop One Stop
Amandla Okuhlanganisa i-PCB:
Usayizi we-Stencil: | 736x736mm |
Iphimbo elincane le-IC: | 0.2mm |
Usayizi we-PCB omkhulu: | 1200x 500mm |
Ubukhulu be-PCB obuncane: | 0.25mm |
Usayizi omncane we-chip: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Usayizi we-BGA omkhulu: | 74x74mm |
Ibhola le-BGA: | 1.00mm (ubuncane), 3.00mm (ubuningi) |
Ububanzi bebhola le-BGA: | 0.40mm (ubuncane), 1.00mm (ubuningi) |
Iphimbo lokuhola le-QFP: | 0.38mm (ubuncane), 2.54mm (ubuningi) |
Umthamo: |
Ubuningi bokukhiqiza obuncane kuya kobukhulu obuphansi Ukwakhiwa kwezihloko zokuqala okungabizi kakhulu Hlela ukulethwa |
Uhlobo lokuhlanganisa: |
Umhlangano wokukhweza okungaphezulu (i-SMT) Umhlangano we-DIP Ubuchwepheshe obuxubile (bokufaka ubuso kanye nokungena embobeni) Ukubekwa ohlangothini olulodwa noma oluphindwe kabili Ukuhlanganiswa kwekhebula |
Uhlobo lwezingxenye: |
Izingxenye ezingasebenzi: Iphakethe elincane njenge-0402 Incane njenge-0201 ngokubuyekezwa komklamo Ama-Ball Grid Arrays (BGA): Incane njenge-pitch engu-.5mm |
Ukuthengwa kwezingxenye: |
I-Turnkey (sihlinzeka ngezingxenye) Kuthunyelwe (unikeza izingxenye) Uhlinzeka ngezingxenye ezithile, thina senza okusele |
Uhlobo lwe-solder: |
Iholwa Ayinawo umthofu/ihambisana ne-ROHS |
Amanye amakhono: |
Izinsizakalo zokulungisa/zokuvuselela Ukuhlanganiswa kwemishini Ukwakhiwa kwebhokisi Umjovo wesikhunta kanye nepulasitiki. |
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