Stencil Size:

736x736mm

Minimum IC Pitch:

0.2mm

Maximum PCB size:

1200x 500mm

Minimum PCB thickness:

0.25mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)

Volume:

One piece to low volume production quantities

Low cost first article builds

Schedule deliveries

Assembly type:

Surface mount(SMT) assembly

DIP assembly

Mixed(surface mount and through hole) technology

Single or double sided placement

Cable assembly

Components type:

Passive components:

As small as 0402 package

As small as 0201 with design review

Ball Grid Arrays(BGA):

As small as .5mm pitch

Parts procurements:

Turnkey(we supply the parts)

Consigned(you supply the parts)

You supply some parts, we do the rest

Solder type:

Leaded

Lead-free/ROHS compliant

Other capabilities:

Repair/rework services

Mechanical assembly

Box build

Mold and plastic injection.