Hongzhou Smart - E etella pele ka lilemo tse 15 le ho feta OEM le ODM
moetsi oa tharollo ea kiosk turnkey
Kopano ea PCB ea elektroniki ea OEM PCBA Multilayer e tenyetsehang
Kopano ea PCB ea elektroniki ea OEM PCBA Multilayer e tenyetsehang
Liodara tsa OEM le ODM lia amoheleha.
Re na le sebaka sa mosebetsi sa ka tlung bakeng sa tšebeletso ea lebenkele le le leng
OEM (Re etsa ho latela moralo oa hau - BOM, mekhoa ea faele ea Gerber le liteko, ha re ntse re u fa litlhahiso tse ntle ka ho fetisisa bakeng sa tlhahiso e bonolo le ho boloka litšenyehelo):
1. Ho fumana le ho reka likarolo
2. Tlhahiso ea PCB
3. Kopano ea Likarolo (likarolo tsa PCBA - SMT le Through Hole)
4. Chip-on-board (COB)
Theknoloji ea ho kenya holim'a metsi (SMT)
Sehlopha sa bolo-gridi (BGA)
Lesoba le phunyeletsang
5. Tlhahiso ea Li-enclosure tsa polasetiki (Hlobo)
6. Tlhahiso ea Tšepe e Koaletsoeng (Sesebelisoa)
7. Kopano ea likhoele tsa cable le terata
8. Kopano ea ho Qetela
9. Teko ea QC
10. Sephutheloana
1 | Mealo | Lehlakore le le Leng, Lera la 2 ho isa ho la 18 |
2 | Mofuta oa thepa ea boto | FR4, CEM-1, CEM-3, boto ea ceramic substrate, boto e thehiloeng ho aluminium, high-Tg, Rogers le tse ling |
3 | Lamination ea lintho tse bonahalang tse kopaneng | Mealo e 4 ho isa ho e 6 |
4 | Tekanyo e phahameng ka ho fetisisa | 610 x 1,100mm |
5 | Mamello ea boholo | ± 0.13mm |
6 | Koahelo ea botenya ba boto | 0.2 ho isa ho 6.00mm |
7 | mamello ea boto ea botenya | Botenya ba boto≤1.0mm: +/-0.1mm |
8 | Botenya ba DK | 0.076 ho isa ho 6.00mm |
9 | Bophara ba bonyane ba mola | 0.10mm |
10 | Sebaka se fokolang sa mola | 0.10mm |
11 | Botenya ba koporo ba lera le ka ntle | 8.75 ho isa ho 175µm |
12 | Botenya ba koporo ba lera le ka hare | 17.5 ho isa ho 175µm |
13 | Bophara ba lesoba la ho tjheka (drile ea mechini) | 0.25 ho isa ho 6.00mm |
14 | Bophara ba lesoba bo felileng (drile ea mechini) | 0.20 ho isa ho 6.00mm |
15 | Ho mamella bophara ba masoba (drill ea mechini) | 0.05mm |
16 | Ho mamella boemo ba masoba (drile ea mechini) | 0.075mm |
17 | Boholo ba lesoba la ho phunya ka laser | 0.10mm |
18 | Botenya ba boto le karolelano ea bophara ba lesoba | 10:01 |
19 | Mofuta oa maske ea solder | Botala, Bosehla, Botsho, Pherese, Boputsoa, Bosweu le Bofubedu |
20 | Maske e nyane haholo ea solder | Ø0.10mm |
21 | Boholo bo fokolang ba lesale la karohano ea maske ea solder | 0.05mm |
22 | Bophara ba lesoba la polaka ea oli ea maske ea solder | 0.25 ho isa ho 0.60mm |
23 | Mamello ea taolo ea impedance | ±10% |
24 | Qetello ea holimo | Boemo ba moea o chesang, ENIG, silevera ea ho qoelisoa, ho penta ka khauta, pane ea ho qoelisoa le monoana oa khauta |
25 | Setifikeiti | ROHS, ISO9001:2008, SGS, setifikeiti sa UL |
26 | Sebopeho sa faele se amohelehang | Faele ea Gerber, letoto la PROTEL, letoto la PADS, letoto la POWER PCB, AutoCAD |
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