I-Hongzhou Smart - Iminyaka eli-15+ ikhokela i-OEM kunye ne-ODM
umenzi wesisombululo se-turnkey se-kiosk
Into yePCB | Umthamo woMveliso | |
Ubalo lweeLeya | 1--20L | |
Izinto ezisisiseko | I-FR4, i-High-TG FR4, i-CEM3, i-aluminium, i-High Frequency (iRogers, iTaconic, i-Aron, i-PTFE, i-F4B) | |
Ubukhulu bezinto (mm) | 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 | |
Ubungakanani bebhodi obuphezulu (mm) | 1200x400mm | |
Ukunyamezelana kweBhodi yoLwahlulo | ± 0.15mm | |
Ubukhulu beBhodi | 0.4mm--3.2mm | |
Ukunyamezela Ubukhulu | ±8% | |
Umgca/indawo encinci | 0.1mm | |
Indandatho encinci ye-Annular | 0.1mm | |
Iphimbo le-SMD | 0.3mm | |
Imingxunya | ||
Ubungakanani beMin Hole (yoomatshini) | 0.2mm | |
Ubungakanani beMin Hole (umngxuma welaser) | 0.1mm | |
Ubungakanani beHole Tol (+/-) | I-PTH:±0.075mm;I-NPTH:±0.05mm | |
Indawo yeHole Tol | ± 0.075mm | |
Ukusikwa | ||
HASL/LF HAL | 2.5um | |
Igolide yokuntywiliselwa | I-Nickel 3-7um Au:1-5u'' | |
Umphezulu Ukugqiba | I-HAL, i-ENIG, iGolide ePlatiweyo, iGolide yokuntywiliselwa, i-OSP | |
Ithusi | ||
Ubunzima beCopper | 0.5--6oz | |
Umbala | ||
Imaski yesolder | Luhlaza, Luhlaza okwesibhakabhaka, Mnyama, Mhlophe, Mthubi, Bomvu, Matt Luhlaza, Matt Mnyama, Matt Luhlaza okwesibhakabhaka | |
Isikrini sesilika | Mhlophe, Mnyama, Luhlaza, Mthubi | |
Ifomathi yeFayile eyamkelekileyo | Ifayile yeGerber,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 | |
Isatifikethi | ROSH,ISO9001,UL | |
Ubungakanani beStencil | 736x736mm |
Ubuncinci be-IC Pitch | 0.2mm |
Ubungakanani obukhulu bePCB | 1200x 500mm |
Ubuncinane bePCB ubukhulu | 0.25mm |
Ubuncinane bobungakanani betshiphusi: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Ubungakanani obukhulu be-BGA: | 74x74mm |
Ibhola ye-BGA: | 1.00mm (ubuncinci), 3.00mm (ubuninzi) |
Ububanzi bebhola ye-BGA: | 0.40mm (ubuncinci), 1.00mm (ubuninzi) |
Intetho yokukhokela yeQFP: | 0.38mm (ubuncinci), 2.54mm (ubuninzi) |
Umthamo: | Inxalenye enye ukuya kumanani aphantsi emveliso Ukwakhiwa kwenqaku lokuqala ngexabiso eliphantsi Cwangcisa ukuhanjiswa |
Uhlobo lwendibano: | Indibano yokukhwelisa umphezulu (SMT) Indibano ye-DIP Itekhnoloji exutyiweyo (yokufaka umphezulu kunye nomngxuma odlulayo) Ukubekwa kwicala elinye okanye eliphindwe kabini Indibano yekhebula |
Uhlobo lwezixhobo: | Izinto ezingasebenziyo: Incinci njengephakheji ye-0402 Incinci njenge-0201 ngophononongo loyilo IiBall Grid Arrays (BGA): Incinci njenge-.5mm pitch |
Ukuthengwa kweenxalenye: | I-Turnkey (sibonelela ngeendawo) Ithunyelwe (uyazibonelela iindawo) Unika ezinye iindawo, thina senza ezinye |
Uhlobo lwesolder: | Inkokeli Ayinalo ilothe/iyathobela i-ROHS |
Ezinye izakhono: | Iinkonzo zokulungisa/zokulungisa ngokutsha Indibano yoomatshini Ukwakhiwa kwebhokisi Inaliti yesikhunta kunye neplastiki. |
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