Kopano ea Elektroniki ea SMT/DIP Kopano ea Boto ea PCB

Boholo ba Pentesele:

736x736mm

Bonyane bophahamo ba IC:

0.2mm

Boholo ba PCB:

1200x 500mm

Botenya bo fokolang ba PCB:

0.25mm

Boholo ba chip bo fokolang:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Boholo bo boholo ba BGA:

74x74mm

Sebaka sa bolo sa BGA:

1.00mm (bonyane), 3.00mm (boholo)

Bophara ba bolo ea BGA:

0.40mm (bonyane), 1.00mm (boholo)

Polelo ea ho etella pele ea QFP:

0.38mm (bonyane), 2.54mm (boholo)

Molumo:

Sengoathoana se le seng ho isa ho palo e tlase ea tlhahiso

Meaho ea pele ea lihlooho e theko e tlase

Kemiso ea ho tlisa thepa

Mofuta oa kopano:

Kopano ea ho kenya holim'a metsi (SMT)

Kopano ea DIP

Theknoloji e tsoakiloeng (e kenngoeng holim'a metsi le e phunyeletsang ka lesoba)

Sebaka se le seng kapa se habeli se nang le mahlakore

Kopano ea cable

Mofuta oa likarolo:

Likarolo tse sa sebetseng:

Sephutheloana se senyenyane sa 0402

E nyane joalo ka 0201 ka tlhahlobo ea moralo

Lihlopha tsa Grid ea Ball (BGA):

E nyane joalo ka bophahamo ba .5mm

Theko ea likarolo:

Turnkey (re fana ka likarolo)

E rometsoe (u fana ka likarolo)

U fana ka likarolo tse ling, rona re etsa tse ling kaofela

Mofuta oa solder:

E etelletsoeng pele

Ha e na lerete/e latela melao ea ROHS

Bokhoni bo bong:

Litšebeletso tsa ho lokisa/ho lokisa bocha

Kopano ea mechini

Kaho ea mabokose

Ente ea hlobo le polasetiki.