Electronic SMT/DIP Assembly PCB Board Assembly
Electronic SMT/DIP Assembly PCB Board Assembly
PCB Assembly Capability:
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Stencil Size: |
736x736mm |
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Minimum IC Pitch: |
0.2mm |
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Maximum PCB size: |
1200x 500mm |
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Minimum PCB thickness: |
0.25mm |
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Minimum chip size: |
0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
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Maximum BGA size: |
74x74mm |
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BGA ball pitch: |
1.00mm (minimum), 3.00mm (maximum) |
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BGA ball diameter: |
0.40mm (minimum), 1.00mm (maximum) |
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QFP lead pitch: |
0.38mm (minimum), 2.54mm (maximum) |
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Volume: |
One piece to low volume production quantities Low cost first article builds Schedule deliveries |
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Assembly type: |
Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly |
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Components type: |
Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
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Parts procurements: |
Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
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Solder type: |
Leaded Lead-free/ROHS compliant |
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Other capabilities: |
Repair/rework services Mechanical assembly Box build Mold and plastic injection. |
